System and method for measuring negative bias thermal instability with a ring oscillator

ABSTRACT

An integrated circuit, in accordance with one embodiment of the present invention, includes a first device under test (DUT) module coupled to a first ring oscillator module and a second DUT module coupled to a second ring oscillator module. The first DUT module is biased such that interface traps are generated during a first mode. The generated interface traps result in a decrease in a first drive current of the first DUT module. The second device under test module is biased to maintain a reference drive current during the first mode. The operating frequency of the first ring oscillator module, during a second mode, is a function of the first drive current. The operating frequency of the second ring oscillator module, during the second mode, is a function of the reference drive current. The integrated circuit may also include a comparator module for generating an output signal as a function of a difference between the operating frequency of the first and second ring oscillator modules.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. patent applicationSer. No. 12/277,227, filed Nov. 24, 2008 now U.S. Pat. No. 7,667,478,which is a continuation application of U.S. patent application Ser. No.12/006,473, filed Jan. 2, 2008, now U.S. Pat. No. 7,456,628, which is acontinuation application of U.S. patent application Ser. No. 11/248,440,filed Oct. 11, 2005, now U.S. Pat. No. 7,315,178, which is a divisionalapplication of U.S. patent application Ser. No. 10/870,752, filed Jun.16, 2004, now U.S. Pat. No. 7,126,365, which are incorporated herein byreference. The U.S. patent application Ser. No. 10/870,752 is acontinuation-in-part of U.S. patent application Ser. No. 10/712,847,filed Nov. 12, 2003, now U.S. Pat. No. 6,903,564; is acontinuation-in-part of U.S. patent application Ser. No. 10/672,793,filed Sep. 26, 2003, now U.S. Pat. No. 6,885,210; and is acontinuation-in-part of U.S. patent application Ser. No. 10/124,152,filed Apr. 16, 2002, now U.S. Pat. No. 6,882,172, which are incorporatedherein by reference.

BACKGROUND OF THE INVENTION

Conventional integrated circuits suffer from numerous reliability anddegradation issues. For deep submicron (DSM) designs issues such as hotcarrier injection (HCI), time dependant dielectric breakdown (TDDB),negative bias thermal instability (NBTI) and the like, increasinglyaffect performance of integrated circuits.

In order to increase the performance of an integrated circuit variousoperating parameters, such as the supply voltage, operating frequency,back bias (e.g., threshold voltage), and/or the like, may be changed.However, there is typically a tradeoff between performance and lifetimeof the integrated circuit. Changing the operating parameters to achieveincreased performance typically results in an increase in stresses, suchas negative bias thermal instability (NBTI). The tradeoff betweenperformance and lifetime may be optimized if NBTI in the integratedcircuit can be measured.

SUMMARY OF THE INVENTION

Accordingly, embodiments of the present invention are directed toward amethod and system for measuring negative bias thermal instability (NBTI)in an integrated circuit, electronic device or the like. In oneembodiment, an integrated circuit includes a first device under test(DUT) module coupled to a first ring oscillator module and a second DUTmodule coupled to a second ring oscillator module. The first DUT moduleis biased such that interface traps are generated during a first mode.The generated interface traps result in a decrease in a first drivecurrent of the first DUT module. The second device under test module isbiased to maintain a reference drive current during the first mode. Theoperating frequency of the first ring oscillator module, during a secondmode, is a function of the first drive current. The operating frequencyof the second ring oscillator module, during the second mode, is afunction of the reference drive current. The integrated circuit may alsoinclude a comparator module for generating an output signal as afunction of a difference between the operating frequency of the firstand second ring oscillator modules.

In another embodiment of the present invention, a method of measuringnegative bias thermal instability (NBTI) includes stressing a firstMOSFET during a normal operating mode. A second MOSFET is maintained asa reference during the normal operating mode. A first and second ringoscillator modules are enabled during a test mode. The operatingfrequency of the first ring oscillator module is a function of the drivecurrent of the first MOSFET. The operating frequency of the second ringoscillator module is a function of the driver current of the secondMOSFET. An output signal is generated as a function of a differencebetween the operating frequency of the first and second ring oscillatormodules during the test mode.

In yet another embodiment, a system for measuring NBTI includes a firstset of inverters, a first NAND gate, a first MOSFET, a second set ofinverters, a second NAND gate and a second MOSFET. The first set ofinverters, a first input and an output of the first NAND gate, and asource and drain of the first MOSFET are coupled in series to form afirst signal loop. A second input of the first NAND gate receives afirst enable signal. A gate of the first MOSFET receives a second enablesignal. The second set of inverters, a first input and an output of thesecond NAND gate, and a source and drain of the second MOSFET arecoupled in series to form a second signal loop. A second input of thesecond NAND gate receives the first enable signal. A gate of the secondMOSFET receives a third enable signal.

Embodiments of the present invention advantageously provide a system andmethod of measuring NBTI utilizing rings oscillators. The age of anassociated integrated circuit, electronic device or the like mayadvantageously be extrapolated from the measurement of NBTI. Themeasurement of NBTI may also advantageously be utilized to adjust thetrade-off between device performance and lifetime.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention are illustrated by way of exampleand not by way of limitation, in the figures of the accompanyingdrawings and in which like reference numerals refer to similar elementsand in which:

FIG. 1 shows a block diagram of a system for measuring negative biasthermal instability (NBTI) in an integrated circuit, in accordance withone embodiment of the present invention.

FIGS. 2A and 2B show a block diagram of an exemplary implementation of asystem for measuring negative bias thermal instability (NBTI), inaccordance with one embodiment of the present invention.

FIG. 3 shows a flow diagram of steps of a method of measuring negativebias thermal instability (NBTI), in accordance with one embodiment ofthe present invention.

DETAILED DESCRIPTION

Reference will now be made in detail to the embodiments of theinvention, examples of which are illustrated in the accompanyingdrawings. While the invention will be described in conjunction withthese embodiments, it will be understood that they are not intended tolimit the invention to these embodiments. On the contrary, the inventionis intended to cover alternatives, modifications and equivalents, whichmay be included within the scope of the invention as defined by theappended claims. Furthermore, in the following detailed description ofthe present invention, numerous specific details are set forth in orderto provide a thorough understanding of the present invention. However,it is understood that the present invention may be practiced withoutthese specific details. In other instances, well-known methods,procedures, components, and circuits have not been described in detailas not to unnecessarily obscure aspects of the present invention.

Referring to FIG. 1, a block diagram of a system for measuring negativebias thermal instability (NBTI) in an integrated circuit 110, inaccordance with one embodiment of the present invention, is shown. Asdepicted in FIG. 1, the system for measuring NBTI includes a first ringoscillator module 120, a first device under test (DUT) module 130, asecond ring oscillator module 140, a second DUT module 150 and acomparator module 160. The first DUT module 130 may be coupled to thefirst ring oscillator module 120. The second DUT module 150 may becoupled to the second ring oscillator module 140. The comparator module160 may be coupled to the first and second ring oscillator modules 120,140, such that the operating frequencies of the first and second ringoscillator modules 120, 140 may be compared.

In a first mode (e.g., normal operating mode), the first and second ringoscillator modules 120, 140 are disabled, such that correspondingoscillator signals are not generated. During the first mode, the firstDUT module 130 (e.g., stressed module) may be biased such that interfacetraps are generated. The generation of interface traps causes negativebias thermal instability in the first DUT module 130. The second DUTmodule 150 (e.g., reference module) may be biased such that interfacetraps are not generated. It is appreciated that NBTI results in anincrease in a threshold voltage and a decrease in drive current in thefirst DUT module 130 over time. The threshold voltage and drive currentin the second DUT module 150, however, will remain substantiallyconstant.

In a second mode (e.g., test mode), the first and second ring oscillatormodules 120, 140 are enabled. Thus, each ring oscillator module 120, 140generates a periodic signal having a frequency that is a function of thedrive current provided by the respective DUT modules 130, 150. Morespecifically, the first ring oscillator module 120 generates anoscillator signal having a first operating frequency that is a functionof the drive current provided by the first DUT module 130. As describedabove, the drive current provided by the first DUT module 130 willdecrease over time during the normal operating mode. Thus, the operatingfrequency of the first ring oscillator module 120 will decrease overtime. The second oscillator module 140 generates a second oscillatorsignal having a second operating frequency that is a function of thedrive current provided by the second DUT module 150. As described above,the drive current provided by the second DUT module 150 will remainsubstantially constant over time. Thus, the operating frequency of thesecond ring oscillator module 140 will remain substantially constantover time.

During the second mode, the comparator module 160 compares the operatingfrequencies of the first and second ring oscillator modules 120, 140.Various embodiments of the comparator modules 160 are described in thefollowing disclosures: U.S. patent application Ser. No. 10/712,847,filed Nov. 12, 2003, by Shingo Suzuki, entitled “A device AgeDetermination circuit,” U.S. patent application Ser. No. 10/672,793,filed Sep. 26, 2003, by Shingo Suzuki, entitled “System and Method forMeasuring Transistor Leakage Current with a Ring Oscillator withBackbias Controls,” and U.S. patent application Ser. No. 10/124,152,filed Apr. 16, 2002, by Shingo Suzuki, entitled “A System and Method forMeasuring Transistor Leakage Current with a Ring Oscillator,” which areincorporated herein by reference. In one implementation, the comparatormodule 160 generates an output signal that is a function of thedifference between the first and second operating frequencies. Thesignal is indicative of the extent of the NBTI degeneration in the firstDUT module 130. It is appreciated that NBTI increases as the integratedcircuit 110 operates over time. Thus, the age of the integrated circuit110 may be extrapolated from the output signal generated by thecomparator module 160.

It is also appreciated that the first and second operating frequenciesmay not be equal at an initial time (e.g., when the integrated circuitis powered up for the first time) due to process variations inmanufacturing the integrated circuit 110. Accordingly, an initialmeasurement of the difference between the first and second operatingfrequencies may be made and stored as an offset for extrapolating theage of the integrated circuit 110. The offset value may be stored in anon-volatile storage module (not shown), such as a set of fuses, staticmemory (e.g., static ROM, static RAM, flash memory, etc.), and the like,internal or external to the integrated circuit 110.

It is appreciated that the comparator module 160 is an optional elementof the system for measuring NBTI. The function of the comparator module160 may also be implemented external to the integrated circuit 110.Furthermore, although embodiments of the present invention are describedas being included in an integrated circuit 110, it is appreciated thatthe system for measuring NBTI may be utilized in conjunction withvarious other electronic devices.

Referring now to FIGS. 2A and 2B, a block diagram of an exemplaryimplementation of a system for measuring negative bias thermalinstability (NBTI), in accordance with one embodiment of the presentinvention, is shown. It is appreciated that NBTI degradation effect ismore pronounced for p-channel metal-oxide-semiconductor field effecttransistors (P-MOSFET) than n-channel metal-oxide-semiconductor fieldeffect transistors (N-MOSFET) due to the presence of holes in theP-MOSFET inversion layer that are known to interact with the oxidestates. Accordingly, the exemplary apparatus is adapted to measure NBTIin P-MOSFETs. The N-MOSFETs in the exemplary implementation areprimarily included to provide symmetry. The system for measuring NBTIincludes a first ring oscillator module 120, a first DUT module 130, asecond ring oscillator module 140 and a second DUT module 150.

As depicted in FIG. 2A, the first ring oscillator module 120 includes afirst set of inverters 202-208 coupled in series with each other to forma first signal loop. Each one of the first set of inverters 202-208 mayhave one or more load gates 210-224 coupled thereto for drawing anappropriate fan-out current. The first ring oscillator module 120 mayalso include a first NAND gate 226 having a first input and an outputcoupled in between a first and second one of the first set of inverters202-208. A second input of the first NAND gate 226 may be coupled to anenable signal (EN). The combination of the first set of inverters202-208 and the first NAND gate 226 results in an odd number of logicstate inversions of a first oscillator signal propagating along thefirst signal loop. It is appreciated that a given one of the first setof inverters 204-208 or the NAND gate 226 also contributes to thefan-out current of the previous one of the first set of inverters202-208.

The first DUT module 130 may include a first set of one or morep-channel metal-oxide-semiconductor field effect transistors (P-MOSFET)228, 230 and/or one or more n-channel metal-oxide-semiconductor fieldeffect transistors (N-MOSFET) 232, 234. Each P-MOSFET 228, 230 of thefirst set may be coupled in the first signal loop such that its sourceis coupled to the output of a respective one of the first set ofinverters 204, 208 and its drain is coupled to a next one of the firstset of inverters 206 or the first NAND gate 226. Each N-MOSFET 232, 234of the first set may be coupled in the first signal loop such that itsdrain is coupled to the output of a respective one of the first set ofinverters 202, 206 and its source is coupled to a next one of the firstset of inverters 204, 208. If the first DUT module 130 includes a firstset of both P-MOSFETs 228, 230 and N-MOSFETs 232, 234, the P-MOSFETs andN-MOSFETs may be alternatingly coupled in the first signal loop.

The first DUT module 130 may also include a second set of inverters 236,238 coupled in series with each other. The input of a first one of thesecond set of inverters 236 may be coupled to a first potential (e.g.,supply voltage). A first DUT enable signal (EN_P1) is generated at theoutput of the first one of the second set of inverters 236. The input ofa second one of the second set of inverters 238 may be coupled to theoutput of the first one of the second set of inverters 236. A second DUTenable signal (EN_N1) is generated at the output of the second one ofthe second set of inverters 238. The gates of each of the first set ofP-MOSFET 228, 230 may receive the first DUT enable signal (EN_P1). Thegates of each of the first set of N-MOSFET 232, 234 may receive thesecond DUT enable signal (EN_N1).

As depicted in FIG. 2B, the second ring oscillator module 140 includes athird set of inverters 252-258 coupled in series with each other to forma second signal loop. Each one of the third set of inverters 252-258 mayhave one or more load gates 260-274 coupled thereto for drawing anappropriate fan-out current. The second ring oscillator module 140 mayalso include a second NAND gate 276 having a first input and an outputcoupled in between a first and second one of the third set of inverters252-258. A second input of the second NAND gate 276 may be coupled to anenable signal (EN). The combination of the third set of inverters252-258 and the second NAND gate 276 results in an odd number of logicstate inversions of a second oscillator signal propagating along thesecond signal loop. It is appreciated that a given one of the third setof inverters 254-258 or the NAND gate 276 also contributes to thefan-out current of the previous one of the third set of inverters252-258.

The second DUT module 150 may include a second set of one or moreP-MOSFETs 278, 280 and/or one or more N-MOSFETs 282, 284. Each P-MOSFET278-280 of the second set may be coupled in the second signal loop suchthat its source is coupled to the output of a respective one of thethird set of inverters 254-258 and its drain is coupled to a next one ofthe third set of inverters 256 or the second NAND gate 276. EachN-MOSFET 282, 284 of the second set may be coupled in the signal loopsuch that its drain is coupled to the output of a respective one of thethird set of inverters 252, 256 and its source is coupled to a next oneof the third set of inverters 254, 258. If the second DUT module 150includes a first set of both P-MOSFETs 278, 280 and N-MOSFETs 282, 284,the P-MOSFETs 278, 280 and N-MOSFETs 282, 284 may be alternatinglycoupled in the second signal loop.

The second DUT module 150 may also include a fourth set of inverters286, 288 coupled in series with each other. The input of a first one ofthe fourth set of inverters 286 may receive the enable signal (EN). Athird DUT enable signal (EN_P2) is generated at the output of the firstone of the fourth set of inverters 286. The input of a second one of thefourth set of inverters 288 may be coupled to the output of the firstone of the fourth set of inverters 286. A fourth DUT enable signal(EN_N2) is generated at the output of the second one of the fourth setof inverters 286. The gates of each of the second set of P-MOSFET 278,280 may receive the third DUT enable signal (EN_P2). The gates of eachof the second set of N-MOSFET 282, 284 may receive the fourth DUT enablesignal (EN_N2).

In a first mode (e.g., normal operating mode), the first ring oscillatormodule 120 does not generate a first oscillator signal (V_(F1)). Morespecifically, a low state enable signal (EN) is received at the firstinput of the first NAND gate 226. When the first input of the first NANDgate 226 is low, the output of the first NAND gate 226 is highregardless of the state of the second input of the first NAND gate 226.Hence, the first NAND gate 226 maintains a steady state around the firstsignal loop.

In the first mode, the first DUT enable signal (EN_P1) is low and thesecond DUT enable signal (EN_N1) is high. Thus, the gate of eachN-MOSFET of the first DUT module 130 is high (e.g., supply voltage(V_(DD))), and the gate of each P-MOSFET is low (e.g., ground (V_(SS))).When the output of the first NAND gate 276 is high, each of the firstset of inverter 202-208 biases the source and drain of a correspondingone of the P-MOSFETs 228, 230 at a high state (e.g., the source voltage(V_(DD))). Accordingly, the P-MOSFETs 228, 230 and/or N-MOSFETs 232, 234of the first set are stressed (e.g., biased such that interface trapsbetween the gate oxide and the silicon substrate are generated). Thethreshold voltage of the first set of P-MOSFETs 228, 230 and/orN-MOSFETs 232, 234 increases and the drive current decreases as a resultof the NBTI stress during the first mode.

In the first mode, the third DUT enable signal (EN_P2) is high and thefourth DUT enable signal (EN_N2) is low. Thus, the gate of each N-MOSFET282, 284 of the second DUT module 150 is low (e.g., ground (V_(SS))),and the gate of each P-MOSFET 278, 280 is high (e.g., the supply voltage(V_(DD))). When the output of the second NAND gate 276 is high, each ofthe second set of inverters 252-258 bias the source and drain of eachP-MOSFET 278, 280 at a low state (e.g., ground (V_(SS))). Accordingly,the P-MOSFETs 278, 280 and/or N-MOSFETs 282, 284 of the third set arenot stressed, thereby providing a reference for determining NBTI.

It is appreciated that the period of time of operating in the first modemay be substantially equal to the period of time that an associatedcircuit, electronic device or the like, is operating. Accordingly, thefirst set of P-MOSFETs 228, 230 and/or N-MOSFETs 232, 234 age atsubstantially the same rate as P-MOSFET and/or N-MOSFET devices utilizedin the integrated circuit, electronic device, or the like.Alternatively, the first set of P-MOSFETs 228, 230 and/or N-MOSFETs 232,234 may represent the worst case of the integrated circuit for aconservative lifetime estimation. However, the third set of P-MOSFETs278, 280 and/or N-MOSFETs 282, 284 are not stressed and therefore do notage an appreciable amount during the first mode.

In a second mode (e.g., test mode), the first DUT enable signal (EN_P1)is low and the second DUT enable signal (EN_N1) is high. Thus, the gateof each N-MOSFET 232, 234 of the first DUT module 130 is high (e.g.,supply voltage (V_(DD))), and the gate of each P-MOSFET 228, 230 is low(e.g., ground (V_(SS))). When the enable signal (EN) switches to a highstate, the first ring oscillator module 120 generates a first oscillatorsignal (V_(F1)). If the first DUT module 130 contains only P-MOSFETs,the operating frequency of the first oscillator signal (V_(F1)) will bea function of the drive current of the P-MOSFETs. If the first DUTmodule 130 contains only N-MOSFETs, the operating frequency of the firstoscillator signal (V_(F1)) will be a function of the drive current ofthe N-MOSFETs. If the first DUT module 130 contains both N-MOSFETs andP-MOSFETs, the operating frequency of the first oscillator signal(V_(F1)) will be primarily a function of the drive current of theP-MOSFETs, with a minor influence on the operating frequency caused bythe N-MOSFETs. It is appreciated, from the above-description of thenormal operating mode, that over time the first set of MOSFETs arestressed resulting in NBTI that will cause a decrease in the drivecurrent over time. Accordingly, the operating frequency of the firstoscillator signal (V_(F1)) will decrease over time.

In the second mode, the third DUT enable signal (EN_P2) switches to alow state and the fourth DUT enable signal (EN_N2) switches to a highstate, when the enable signal switches to a high state. Thus, the gateof each N-MOSFET 282, 284 of the second DUT module 150 is high (e.g.,supply voltage (V_(DD))), and the gate of each P-MOSFET 278, 280 is low(e.g., ground (V_(SS))). Thereafter, the second ring oscillator module140 generates a second oscillator signal (V_(F2)). It is appreciated,from the above-description of the normal operating mode, that the drivecurrent of the third set of MOSFETs will remain substantially constantover time. Accordingly, the operating frequency of the second oscillatorsignal (V_(F2)) will remain substantially constant. In an actual case,it may not be constant due to drive current degradation in the third setof inverters 252, 254, 256, 258 and the second NAND gate 276. However,the rate of the “native” drive current degradation is the same in boththe first and the second ring oscillator modules 120, 140. Hence, thedifference between the operating frequencies of ring oscillator modules120, 140 indicates the age of the device under test.

Negative bias thermal instability may be measured by determining thedifference between the operating frequency of the first and secondoscillator signals (V_(F1), V_(F2)). It is appreciated that theoperating frequency of the first and second oscillator signals (V_(F1),V_(F2)) may be measured at any node of the first and second signalloops. It is also appreciated that NBTI in the system will increase overtime. Thus, the age of the associated integrated circuit, electronicdevice or the like, may be extrapolated from the measurement of NBTI. Todetermine the age of the integrated circuit, electronic device, or thelike, the second mode (e.g., test mode) may be initiated periodically orin response to a measurement request.

It is appreciated that the difference between the operating frequenciesof the first and second ring oscillator modules 120, 140 may be utilizedto adjust the trade-off between device performance and lifetime. Thetrade-off between device performance and lifetime may be adjusted byadjusting various parameters, such as supply voltage level, operatingfrequency, back bias (e.g., threshold voltage), operating temperatureand/or the like in response to the difference between the operatingfrequencies of the first and second ring oscillator modules 120, 140(e.g., age of the device).

It is also appreciated that in the first mode, the first set of MOSFETs228-234 are subject to static NBTI (e.g., DC stress), which leads torelatively rapid degeneration of the threshold voltage and drive currentparameters. The rapid degradation caused by DC stress results in arelatively short lifetime of the MOSFETs 228-234. In the second mode,the first and second sets of MOSFETs 228-234, 278-284 are subject todynamic NBTI (e.g., AC stress). When the DC stress is periodicallyinterrupted (e.g., AC stress is applied), the degradation is at leastpartially recovered (e.g., the interface traps generated during the onstate of the MOSFETs 228-234 are partially annealed during their offstate) and the lifetime of the MOSFETs 228-234 is increased.Accordingly, measurement of NBTI shortly after (e.g., within a fewseconds or less) switching from the first state (e.g., static NBTI) tothe second state (e.g., dynamic NBTI) may allow for determining theextent of static NBTI. Continued measurement during the second state mayallow for determining the amount and rate of recovery from NBTIdegradation.

Referring now to FIG. 3, a flow diagram of steps of a method ofmeasuring negative bias thermal instability (NBTI), in accordance withone embodiment of the present invention, is shown. As depicted in FIG.3, the method of measuring NBTI includes a normal operating mode and atest mode. In the normal operating mode, first and second ringoscillator modules may be disabled, at 310. In one implementation, firstand second NAND gates, of the respective first and second ringoscillator modules, receive an enable signal at a respective firstinput. A respective second input and a respective output of the NANDgates are coupled in series in a feedback loop of the respective ringoscillator modules. In the normal operating mode, the enable signal isat a first state (e.g., low voltage level) and therefore the output ofeach of the NAND gates are at a second state (e.g., high voltage level).When the outputs of the NAND gates are held at the second state, thefirst and second ring oscillator modules do not generate oscillatorsignals.

At 320, a first DUT module, coupled to the first ring oscillator module,may be biased such that interface traps are generated between a gateoxide and a substrate during the normal operating mode. The generationof interface traps results in a decrease in a drive current in the firstDUT module over time.

At 330, a second DUT module, coupled to the second ring oscillatormodule, may be maintained as a reference during the normal operatingmode. Accordingly, the drive current in the first DUT module remainssubstantially constant over time.

At 340, the first and second ring oscillator modules may be enabledduring the test mode. The operating frequencies of the first and secondring oscillator modules are each a function of the drive current of therespective DUT module coupled thereto. In one implementation, the enablesignal may be switched to a second state (e.g., high voltage level), andtherefore, the output of each of the NAND gates are at the first state(e.g., low voltage level). When the output of the NAND gates are held atthe first state, and the first and second ring oscillator modulesgenerate oscillator signals having operating frequencies that are afunction of the respective drive currents.

At 350, the operating frequencies of the first and second ringoscillator modules may be compared during the test mode. A signalindicative of the effect of NBTI may be generated as a result of thecomparison. It is appreciated that the age of an integrated circuit maythen be extrapolated from the result of the comparison.

The test mode may be entered upon one or more conditions, at 360. In oneimplementation, the test mode may be initiated periodically or inresponse to a measurement request. It is appreciated that the period oftime of the test mode should be negligible compared to the normaloperating mode.

Accordingly, embodiments of the present invention provide a system andmethod of measuring negative bias thermal instability utilizing ringoscillators. The age of an associated integrated circuit, electronicdevice or the like may advantageously be extrapolated from themeasurement of the NBTI. The measurement of NBTI may also advantageouslybe utilized to adjust the trade-off between device performance andlifetime.

The foregoing descriptions of specific embodiments of the presentinvention have been presented for purposes of illustration anddescription. They are not intended to be exhaustive or to limit theinvention to the precise forms disclosed, and obviously manymodifications and variations are possible in light of the aboveteaching. The embodiments were chosen and described in order to bestexplain the principles of the invention and its practical application,to thereby enable others skilled in the art to best utilize theinvention and various embodiments with various modifications as aresuited to the particular use contemplated. It is intended that the scopeof the invention be defined by the Claims appended hereto and theirequivalents.

1. A method of measuring negative bias thermal instability, said methodcomprising: generating a first oscillator signal responsive to a firstdrive current of a first device under test when in a first mode ofoperation; generating a second oscillator signal responsive to areference drive current of a second device under test when in said firstmode of operation; and determining negative bias thermal instability bycomparing said first oscillator signal to said second oscillator signal.2. The method of claim 1 further comprising: disabling said firstoscillator signal when said first device under test is operating in asecond mode of operation; and disabling said second oscillator signalwhen said second device under test is operating in said second mode ofoperation.
 3. The method of claim 1 further comprising: generatinginterface traps operable to decrease said first drive current when saidfirst device under test is operating in a second mode.
 4. The method ofclaim 3, wherein said generating interface traps results in an increasein a threshold voltage and a decrease in drive current of said firstdevice under test.
 5. The method of claim 1 further comprising:substantially maintaining said reference drive current.
 6. The method ofclaim 1, wherein said determining further comprises: generating anoutput signal that is a function of a difference between said operatingfrequency of said first oscillator signal and said second oscillatorsignal.
 7. The method of claim 1, wherein said first device under testand said second device under test comprise at least one transistor.
 8. Amethod of measuring negative bias thermal instability, said methodcomprising: biasing a first device under test; biasing a second deviceunder test; driving a first oscillator with said first device undertest; driving a second oscillator with said second device under test;and comparing a first output signal from said first oscillator with asecond output signal from said second oscillator to determine negativebias thermal instability.
 9. The method of claim 8 further comprising:enabling said first oscillator signal when said first device under testis operating in a first mode of operation; and enabling said secondoscillator signal when said second device under test is operating insaid first mode of operation.
 10. The method of claim 8 furthercomprising: disabling said first oscillator signal when said firstdevice under test is operating in a second mode of operation; anddisabling said second oscillator signal when said second device undertest is operating in said second mode of operation.
 11. The method ofclaim 8, wherein said biasing said first device under test comprises:causing generation of interface traps in said first device under test.12. The method of claim 11, wherein said causing leads to an increase ina threshold voltage and to a decrease in drive current of said firstdevice under test.
 13. The method of claim 8, wherein said driving saidsecond oscillator with said second device under test comprises:generating a substantially constant drive current.
 14. The method ofclaim 8, wherein said comparing comprises: generating an output signalrepresenting a function of a difference between a frequency of saidfirst output signal and a frequency of said second output signal. 15.The method of claim 8, wherein said first device under test and saidsecond device under test each comprise at least one transistor.
 16. Amethod of measuring negative bias thermal instability, said methodcomprising: driving a first oscillator with a first device under testbiased for generation of interface traps; driving a second oscillatorwith a second device under test; and comparing a first output signalfrom said first oscillator with a second output signal from said secondoscillator to determine negative bias thermal instability.
 17. Themethod of claim 16, wherein said generation of interface traps leads toan increase in a threshold voltage and a decrease in drive current ofsaid first device under test.
 18. The method of claim 16, wherein saiddriving said second oscillator with said second device under testcomprises: generating a substantially constant drive current.
 19. Themethod of claim 16, wherein said comparing comprises: generating anoutput signal representing a function of a difference between afrequency of said first output signal and a frequency of said secondoutput signal.
 20. The method of claim 16, wherein said first deviceunder test and said second device under test each comprise at least onetransistor.